Lithography

The most fundamental part of any microfabrication process is the ability to pattern films to create the desired features onto the substrate. Hawk provides a variety of lithography technologies for wafers up to 150 mm in order to maximize our patterning ability for our customers. We offer a variety of services including grey scale, projection, contact, e-beam and direct write lithography. We also have the capability to make mask plates in-house.

• I-line 5x reduction stepper for die sizes upto 14.7 mm

• Contact aligners including backside alignment

• Direct writing system capable of 2 um CD

• Automated photoresist dispense and development tools to minimize particulate

• CD capabilities include +/- .15 um stepper, +/- .3 um contact aligner 

• Overlay tolerances: +/-  .25 um stepper, +/- 2 um contact aligner

Deposition

From LPCVD to e-beam evaporation, Hawk offers a wide range of deposition technologies to allow for a vast array of materials for your devices. We also have many different thermal technologies from RTA to vacuum-backed diffusion furnaces.

• 15 LPCVD tubes capable of servicing up to 150 mm wafers

• Multiple oxidation tubes for thermal oxidation

• 5 annealing furnaces and multiple RTAs

• Magnetron sputtering equipment capable of heating and reactive sputtering

• Dedicated AlN sputtering system

• ALD suite

• E-beam deposition 

• More common metals include: Ti, Al, W, Ti-W, Co, Au, Pt, Ir, Kanthal, Cr, Ta, Mo, Ag, Fe

• Common semiconductors include: Si, Ge, SiGe

• Common dielectrics include: SiO2, Si3N4, LSN, ITO, TiO2, Ta3O5

• Plating including: Au, Ni, NiFe, Cu, In

Etching

Hawk has many different wet and dry etching techniques available to help create devices.

• DSE capability at Hawk is extensive. We have shown aspect ratios of 40:1 using our DSEs and regularly customize processes to suit our customers’ needs. 

• Advanced SiO2 etcher for deep anisotropic SiO2 etching

• Ion milling for when physical etching is required

• Anisotropic Si etching

• Metal wet etching including Au, Ti, Ni, Cr, W, TiW, Al

• Semiconductor isotropic wet etching including Si, Ge, SiGe

• Dielectric wet etching including SiO2, Si3N4, Al2O3, Ti2O3, Ta2O5

Metrology

With a large metrology portfolio, Hawk Semiconductor is able to both verify process parameters are met during production and perform failure analysis. We are able to measure refractive index, reflectivity, CD, material composition, profile, and depth just to name a few.

• FE-SEM with EDX

• M2000 Ellipsometer

• Interferometer

• Stylus profilometer

• AFM

• FTIR

• Fluorescent microscopy